Omron introduces 1x64 splitter planar waveguide

Omron Components Business - Europe has extended its range of compact bi-directional PLC splitter modules for Passive Optical Networks with a new 1x64 version. Omron P1C planar waveguide devices are suitable for FTTx Passive Optical Networks, DWDM and CWDM systems, optical cable TV and other outside equipment applications. The new 1x64 version complements the existing 1x4, 1x8, 1x16 and 1x32 splitters already available.

Each device in the range is a packaged optical waveguide chip based on patented plasma chemical vapour deposition (P-CVD) technology. The combination of PLC structure and P-CVD process technology provide high stable optical characteristics and good reliability. In addition, the splitter modules exhibit low insertion loss, low polarisation dependent loss and high port uniformity. The splitters are tested to Telcordia GR1209 and GR1221. Optional custom packaging, metal fittings and connectorised cassette modules are also available. All products are immediately available to order.

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TI expands application chips beyond phones

Texas Instruments Inc (TXN.N: Quote, Profile , Research) unveiled new application chips on Tuesday that can be used in everything from music players to medical equipment, with an aim of expanding its business beyond the cell phone chip market.

TI, which faces competition from Qualcomm Inc (QCOM.O: Quote, Profile , Research) in the wireless market, said it would address broader markets with by expanding its OMAP product line, which is mostly used to support features like gaming and video in cell phone.

"We're basically making this technology available to thousands of customers instead of tens of customers," said Neil Anderskouv, vice president of TI's digital systems business.

TI would not disclose any revenue projections.

TI's OMAP 3500 line of digital chips would support features such as graphics displays in navigation equipment, medical imaging equipment or music players, he said.

The company is working with as many as 100 clients on making products using the new chips, Anderskouv said, but did not name the clients.

TI, whose biggest client is the world's largest cell phone maker Nokia (NOK1V.HE: Quote, Profile , Research), derives about 40 percent of its revenue from wireless chips.

San Diego-based Qualcomm has been making inroads on TI in the market for advanced phones, and overtook its Dallas-based rival in the wireless chip market in the first quarter of 2007.

Qualcomm ended 2007 with an 18.2 percent share of the $30.8 billion cellular chip market, compared with TI's 16 percent share, according to estimates from research firm iSuppli.

In-Stat analyst Jim McGregor said it made sense for TI to bring out versions of OMAP to suit other markets.

"It wasn't necessarily the best fit outside wireless," McGregor said.

TI said its OMAP3503 chipset would ship within four weeks. It also announced OMAP3515, OMAP3525 and OMAP530, which it said would be available in the second half of the year.

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Closed-loop digital-input Class D amp is industry’s first

Architecture improves sound quality, reduces power demands, and lowers audio subsystem cost

Claimed to be the first closed-loop digital-input Class D amplifier, the TAS5706 improves sound quality and lowers system cost by relaxing power supply performance requirements. Targeting the HDTV market, the 20-W device speeds time to market and provides flexible output configurations along with easy-to-use support tools.

For LCD TVs, the audio amp can be powered from the existing 24-V backlight power supply, making a dedicated power rail for the audio subsystem unnecessary. Other sound enhancement features include dynamic range compression, a dedicated subwoofer channel for 2.1 applications, and speaker equalization.Housed in a QFP package, the amp supports stereo, quad, and 2.1 output configurations along with PWM headphone and subwoofer outputs. ($5.46 ea/100 — available now.)

Texas Instruments, Dallas, TX
Product Information Center 800-477-8924
http://www.ti.com

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Tyco Electronics RN73 high stability precision chip resistors

The RN73 series of high stability precision chip resistors from Tyco Electronics has been extended to offer resistance tolerances down to 0.01 per cent, which means the devices are up to 10 times more accurate than previously available versions.

The resistors are available in a choice of packages, down to 0402 case size. Standard package size is 0805.

Based on nichrome thin film technology, the devices are produced with three sputtered layers of resistive metal film. This enables very stable high frequency performance to be achieved.

Temperature coefficient of resistance values down to 10ppm/ deg C, and even 5ppm/ deg C for some case sizes, are available over a wide value range (5R1 - 470K) in the E96 and E24 value grids.

For applications requiring higher power, the alternative RP73 series resistors offer increased power dissipation, higher temperature capabilities (up to +155 deg C) and increased operating voltages (200Vdc) compared to the standard RN73 series.

See www.tycoelectronics.com

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STMicroelectronics VD6725 small 2megapixel optical-format imaging sensor

STMicroelectronics has introduced its smallest single-chip 2megapixel camera sensor for mobile applications.

The VD6725 is a 1/5-inch optical-format imaging sensor, with an active pixel array of 1600x1200 (UXGA), image processor and camera control functions on a single chip. It is designed to fit in phone camera modules smaller than 6x6x3.8mm due to its 1.75-micron pixel design.

The device's image processor will support features such as flipped and mirror-reversed images or pure black-and-white conversion for whiteboard content capture, document extraction and barcode reading.
IT will also produce digital video streams at 15frames per second at full UXGA resolution and 30fps at VGA resolution. It supports fast context switching, which means that the sensor switches extremely fast from 'preview' to 'capture mode', minimizing the delay of the capture control.

The single-chip camera sensor is available in the firm's Through Silicon Via wafer-level package. This type of package enables the production of reflowable camera modules which can be soldered directly on the phone motherboard.

See www.st.com

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National Instruments USB-5132/5133 digitisers and USB-4065 digital multimeter

National Instruments has announced the release of the NI USB-5132/5133 digitisers and the NI USB-4065 6½-digit digital multimeter (DMM).

These instruments feature bus-powered and plug-and-play operation and they are also shipped with the LabVIEW SignalExpress LE interactive measurement workbench for acquiring, analysing and presenting data, with no programming required.  

The USB-5132/5133 50Msample/s and 100Msample/s digitisers offer two simultaneously sampled channels with 8-bit resolution. These USB digitisers feature 10 input ranges from 40mV to 40V and programmable DC offset, and come standard with 4Mbyte/channel of onboard memory for measurements requiring extended data captures.

The USB-4065 DMM offers 6.5 digits of resolution at up to 10 readings per second and up to 3,000 readings per second at lower resolutions. With +/-300V of isolation, current measurements up to 3A and 2- or 4-wire resistance measurements, the USB-4065 offers a complete multimeter for portable 6.5 digit measurement needs.

See www.ni.com

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International Rectifier triple output DC-DC power converters

International Rectifier has introduced a range of triple output DC-DC power converters, the Mx series, designed for space applications powering specific RF communication satellite applications.

The Mx series converters can be configured to meet a range of spacecraft power bus voltages, varying output load requirements, and telemetry needs, and are optimized to ensure maximum performance for sensitive RF equipment onboard spacecraft, such as receivers, transmitters, beacons, low noise amplifiers (LNAs), and up/down converters.

The aim is to offer the cost benefits of a high volume standard product with a customisable product.  
Two power levels are available. The MA platform is rated at 5W and the MB platform is rated at 15W output power. The platform has three outputs; each output can be configured from 3.3V to 15V and independently regulated to eliminate cross talk and minimize noise.

Output noise is less than 1mVRMS and conducted susceptibility (CS) rejection is better than 95dB.  In addition, the converter offers output voltage accuracy and end-of-life output voltage variations of less than two per cent.

The converters are designed to accommodate common satellite power buses from 20V to 100V. An input filter is included to meet stringent EMI requirements. Isolated telemetry/tele-command interface and output turn-on/turn-off sequencing (normally required by RF amplifiers) capability are also offered.

See www.irf.com

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